Advanced Packaging Overview – Design through Assembly and Test: FlipChip and SiP Packages The webinar will discuss: Design implications and considerations Substrate discussion Different approaches on FlipChip and SiP Assembly considerations Testing and Qualification Have questions? Let us know TechnicalHotline@integra-tech.com

TOPICS INCLUDE: Problem of Obsolescence and its impact on Aerospace and Defense companies Pros and Cons of various solutions to Obsolescence Board re-designs Replacement of obsolete products with equivalent currently offered products Board Interposers for equivalent product in different form factor US based manufacturing with long term manufacturing, kitting and storage Manufacture from die bank / Re-engineering Broker purchase – Pros an...